UPISEL N and EXSYLAM NT are polyimide based non-adhesive flexible copper clad laminates having superior dimensional stability and heat resistance highly regarded in the electronics material industry such as mobile devises.
“UPISEL” is a registered trademark of UBE Corporation in Japan. “EXSYLAM” is a registered trademark of UBE Exsymo Co., Ltd. in Japan.

• Non-adhesive copper clad laminate having excellent peeling strength, solder heat resistance, chemical resistance and dimensional stability by UBE Exsymo’s proprietary laminating process.
• This proprietary process provides laminates of wide range of copper thickness（２-300μm） and other metal foils such as copper alloy.
• There is no performance degradation due to adhesive layer and is an environmentally friendly halogen free product.