Low Dk/Df Insulation MaterialEXSYLAM-L
EXSYLAM-L is a flexible copper clad laminate based on a liquid crystal polymer film, a material having a low dielectric constant and low dielectric dissipation. Superior in high-frequency characteristics, it is suitable for parts of devices that require a capacity increase in signals and high communication speed, i.e., high-frequency circuit boards, antennas, and millimeter-wave radar antennas.
- With a low dielectric constant and low dielectric dissipation, the product is suitable for flexible printed substrates used for high-speed transmission.
- Its low water absorption rate achieves stability with low transmission loss.
- Adopting low roughness copper foil achieves a further reduction in transmission loss.
- UEXC laminate technology endows the products with stable peel strength and dimensional stability.